TAIPEI, Oct. 25,
2023 /PRNewswire/ -- Interconnect Solutions (ICS),
part of DuPont Electronics & Industrial, a total solution and
system design partner focusing on signal integrity and power
transmission, is exhibiting its broad portfolio of advanced circuit
materials and solutions at the Taiwan Printed Circuit Association
(TPCA) Show at the Taipei Nangang Exhibition Center from
October 25-27, 2023. DuPont will
exhibit in Booth #N419.
With the advancements of Artificial Intelligence (AI), Machine
Learning (ML) and 5G networks, there is a growing demand for
high-speed and high-frequency devices to meet the rapid development
of data generation. The Printed Circuit Board (PCB) industry is
facing significant challenges and trends in miniaturization and
increased functionality of electronic devices with the adoption of
more densely packed and highly integrated package substrates and
printed circuit boards.
"At DuPont, we have built strong capabilities globally in the
PCB industry and across the value chain," said Yuanyuan Zhou, global business director,
Metallization & Imaging, ICS. "Our team has been developing
industry-leading advanced metallization chemistries that enable the
fast-growing AI applications. Furthermore, with the latest
integration of machine learning in our product design, we are able
to accelerate our speed to market and offer novel solutions that
streamline the design process, increase manufacturing yield and
enhance the overall efficiency for our customers."
DuPont's total solution offerings for the substrate and PCB
market enable design engineers to apply high-performing materials
and advanced chemistry to flex, rigid-flex, rigid PCB, and IC
substrate configurations for higher performance and efficiency.
With innovative solutions for IC substrates, advanced Multi-layer
Board (MLB) full process, and AI applications, DuPont will present
advanced circuit materials for AI chip and server-station
applications at the show.
DuPont™ Copper Gleam™ PPR-III pulse acid plating copper —
As a new generation pulse electroplating for advanced MLB and AI
server station applications, it is designed for excellent throwing
power on through-hole to fulfill future fine line trend and
reliability requirements.
DuPont™ Circuposit™ SAP8000 electroless copper — A
new generation SAP metallization technology, an ionic base catalyst
electroless copper process, is designed for advanced package
substrates such as high-end CPU or GPU and AI chip
applications.
DuPont™ Microfill™ SFP-II-M acid plating copper — A novel
pattern plating solution for advanced package substrates and AI
chip application, is designed for good pattern distribution on big
unit sizes for high-performance computing applications.
DuPont™ Riston® DI1500 & DI1600M
dry film photoresist — An advanced fine line
direct imaging photoresist solution for IC substrate application,
with excellent fine line adhesion and resolution as well as
high-yield performance.
In addition, with the rapid development of 5G, the Internet of
Things, and autonomous driving technologies, the PCB industry is
facing a huge challenge in reducing insertion loss and ensuring
signal integrity for interconnect applications. DuPont's total
solutions to enable low-loss and signal integrity are designed to
meet the needs for higher frequency and higher speed
signal-transmission applications.
DuPont™
Pyralux® TFH/TFHS/GFL flexible
copper-clad laminate — An industry-leading signal integrity
solution for consumer electronics. DuPont's design capabilities
enable a total solution for superior insertion loss over
non-in-kind while retaining the benefits of processibility and
bending performance by modified Polyimide (mPI).
DuPont™ Pyralux® AP
flexible copper-clad laminate — An ideal Flexible Printed
Circuit (FPC) laminate solution for high-reliability applications
such as aerospace, defense, automotive, telecom, industrial and
medical use. Its reliability has been proven with a track record
spanning around 30 years.
DuPont™ Interra® HK04J embedded capacitance
laminate — A thin buried capacitance laminate designed to
function as a power and ground plane in high-speed signal
transmission PCB to improve power integrity for communications
applications. It meets generative AI high-speed computing PCB power
integrity and device minimization requirements.
Laird Performance Materials, now part of
DuPont, designs and manufactures high-performance materials to
mitigate electromagnetic interference and suppress broadband common
mode noise. Offerings include Laird™ Tflex™/Tputty™
thermal interface material designed to minimize
electromagnetic interference and Laird™ Steward™ CM5441/CM6050
inductive component designed to stop broadband common mode
noise effectively and efficiently.
About DuPont Electronics & Industrial
DuPont
Electronics & Industrial is a global supplier of new
technologies and performance materials serving the semiconductor,
circuit board, display, digital and flexographic printing,
healthcare, aerospace, industrial and transportation industries.
From advanced technology centers worldwide, teams of talented
research scientists and application experts work closely with
customers, providing solutions, products and technical service to
enable next-generation technologies. More information about DuPont
Electronics & Industrial can be found at
https://www.dupont.com/electronics-industrial.html.
About DuPont
DuPont (NYSE: DD) is a global
innovation leader with technology-based materials and solutions
that help transform industries and everyday life. Our employees
apply diverse science and expertise to help customers advance their
best ideas and deliver essential innovations in key markets
including electronics, transportation, construction, water,
healthcare and worker safety. More information about the company,
its businesses and solutions can be found at
www.dupont.com. Investors can access information included on
the Investor Relations section of the website at
investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service
marks denoted with ™, SM or ® are owned
by affiliates of DuPont de Nemours, Inc. unless otherwise
noted.
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SOURCE DuPont