Showcase Features the Purion and GSD
Ovation Series of Ion Implanters Designed to Deliver Significant
Technology and Manufacturing Advantages
BEVERLY,
Mass., Dec. 5, 2023 /PRNewswire/ -- Axcelis
Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling
ion implantation solutions for the semiconductor industry,
announced today that it will showcase its Purion™ and GSD Ovation™
Series of ion implanters at the SEMICON Japan 2023 exhibition. The
conference and exhibition is being held December 13-15, at the Tokyo Big Sight in
Tokyo, Japan. Axcelis will be
located in East Hall 5, Booth #5821.
Semiconductor manufacturers are invited to visit the Axcelis
exhibit to learn first-hand about innovative ion implant solutions
that deliver significant technology and manufacturing
advantages.
- Purion Power Series™ - Featuring Axcelis' innovative
solution for thin silicon, TAIKO and silicon carbide (SiC) wafer
processing across the full power device applications space.
- Purion H™ Series - Including the new Purion H5™ and
the Purion Dragon™, both designed to provide a comprehensive
solution for high current implants.
- Purion H200™ - Axcelis' state of the art single
wafer high current medium energy implanter designed to address the
unique implant needs for devices designed for the Internet of
Things (IoT) and power applications.
- Purion XE™ Series - Including the new Purion XEmax™, is
the industry leading high energy implant platform, featuring
patented Boost Technology™, designed for the most advanced image
sensor applications up to 15MeV.
- Purion M™ Series - Offering the broadest spectrum of
mid-current doses available, enabling unparalleled flexibility to
meet today's evolving implant requirements.
- GSD Ovation™ - Providing the most
cost-effective way to extend high current and high energy batch
platform capability by supporting emerging applications in wafer
splitting (Si and SiC) and alternate substrates (lithium tantalate
and ceramic).
During the show, Axcelis will also host the following events
on Thursday, Dec. 14th:
- SiC Power Device Manufacturing Ion Implant
Technology
Exhibitor's TechSPOT Hall 5, 15:30 - 15:50 p.m.
The power device market is at a critical inflection point as
chipmakers transition from 150mm to 200mm SiC wafers. Ion implant
equipment needs to offer the flexibility to handle multiple wafer
sizes, various substrate types and operate at various implant
temperatures.
- Axcelis Happy Hour Celebration
East Hall 5 Booth
#5821, 16:00 – 17:00 p.m.
Join us for beverages and light snacks and meet the Axcelis
team.
President and CEO of Axcelis Technologies Russell Low, said,
"We're excited to be a part of this important market and the
opportunity to provide the most advanced ion implant technology to
Japan chipmakers. Our family of
application specific systems address high current, medium current,
medium energy, and high energy implant requirements for all
existing and emerging IC applications."
Charles Pieczulewski, Axcelis
Country Manager, Japan, commented,
"We're pleased about our growing installed base in Japan power device manufacturing and remain
focused on expanding our market share by providing customers the
most innovative, enabling implant technology and support solutions
to ensure their success. Japan
customers continue to be very impressed by Axcelis' broad implant
product portfolio also for memory, logic and image sensors."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered
in Beverly, Mass., has been
providing innovative, high-productivity solutions for the
semiconductor industry for over 45 years. Axcelis is dedicated to
developing enabling process applications through the design,
manufacture and complete life cycle support of ion implantation
systems, one of the most critical and enabling steps in the IC
manufacturing process. Learn more about Axcelis at
www.axcelis.com.
AXCELIS CONTACTS:
Japan:
Charles Pieczulewski (Country
Manager, Japan)
+81.3.5860.2586
Global:
Maureen Hart (editorial/media)
+1.978.787.4266
Doug Lawson (investor relations)
+1.978.787.9552
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SOURCE Axcelis Technologies, Inc.