Soitec Increased Production of Bonded SOS Wafers to Meet Peregrine Semiconductor Demand
06 November 2012 - 10:00PM
Business Wire
Soitec (Euronext Paris), a world leader in generating and
manufacturing revolutionary semiconductor materials for the
electronics and energy industries, today announced it has more than
doubled production of bonded silicon-on-sapphire (BSOS) substrates
to meet increased demand from its strategic partner, Peregrine
Semiconductor Corporation (NASDAQ: PSMI). Peregrine
Semiconductor, a fabless provider of high-performance radio
frequency integrated circuits (RFICs), has increased
peak-production capability of its latest-generation STeP5
UltraCMOS® technology-based RF switches to more than
two million units a day, to support design wins in the Radio
Frequency Front Ends (RFFEs) of today’s most advanced 4G smart
phones, and other wireless-communication applications. These wins
established Peregrine Semiconductor as the market leader for the
main RF antenna switch for cellular handsets1.
Soitec’s direct wafer-bonding technologies are used to produce
the BSOS substrate employed in the manufacture of Peregrine
Semiconductor’s highly-tuned semiconductor wafers. The combination
of Soitec’s innovative substrate, and Peregrine Semiconductor’s
UltraCMOS process technology, and IC design expertise, enable
high-performance RFICs for a variety of applications.
“We are experiencing powerful traction in the market with the
latest STeP5 UltraCMOS RF switches, and we believe these products
enable the high level of RF performance that is critical for new,
4G LTE smartphones and wireless devices,” said Mark Miscione, vice
president of RF Technology Solutions for Peregrine Semiconductor.
“Soitec’s expertise has been important in the development of a
substrate technology that offers the reliability, yield, and
process scalability of equivalent bulk CMOS technologies. We are
pleased with the continued commitment and support we receive.”
“As a result of supporting Peregrine Semiconductor’s continued
strong growth, we have reached a new level in high-volume
manufacturing for our bonded-SOS product,” said Bernard Aspar, vice
president of Soitec’s Layer Transfer Solutions Business Unit.
“Bonded SOS is part of our strategy to deliver leading-edge
engineered substrates for mobile electronic-device markets.”
About Peregrine Semiconductor
Peregrine Semiconductor (NASDAQ: PSMI) is a fabless provider of
high-performance radio frequency integrated circuits (RFICs). Our
solutions leverage our
proprietary UltraCMOS® technology,
an advanced RF Silicon-On-Insulator process. Our products deliver
what we believe is an industry-leading combination of performance
and monolithic integration, and target a broad range of
applications in the aerospace and defense, broadband, industrial,
mobile wireless device, test and measurement equipment, and
wireless infrastructure markets. Additional information is
available on the Company’s website
at http://www.psemi.com.
About Soitec
Soitec is an international manufacturing company, a world leader
in generating and manufacturing revolutionary semiconductor
materials at the frontier of the most exciting energy and
electronic challenges. Soitec’s products include substrates for
microelectronics (most notably SOI: Silicon-on-Insulator) and
concentrator photovoltaic systems (CPV). The company’s core
technologies are Smart Cut™, Smart Stacking™ and Concentrix™, as
well as expertise in epitaxy. Applications include consumer and
mobile electronics, microelectronics-driven IT, telecommunications,
automotive electronics, lighting products and solar power plants
for large-scale utilities. Soitec has manufacturing plants and
R&D centers in France, Singapore, Germany, and the United
States. For more information, visit
http://www.soitec.com.
The Peregrine Semiconductor name, logo, and
UltraCMOS are registered trademarks of Peregrine Semiconductor
Corporation in the U.S.A., and other countries. Soitec, Smart Cut,
Smart Stacking and UNIBOND are trademarks of S.O.I.TEC Silicon On
Insulator Technologies. All other trademarks are the property of
their respective owners.
1 Andoh, Yoshiyasu (Navian Inc). RF Devices/Modules For Cellular
Terminal Quarterly Market Report CY2012 2Q, Oct. 5, 2012: page
153.
Tags/Keywords:
RF CMOS IC, Silicon-on-Sapphire, UltraCMOS,
RFIC
Hi-res Peregrine Semiconductor logo available through
editorial contact, or Flickr (feel free to publish):
http://www.flickr.com/photos/peregrinesemiconductor/7556951016/
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