LINKE Interlink Electronics (MM)

Interlink Electronics Inc. (NASDAQ:LINKE), a world leader in the development of intuitive interface solutions and technologies, announced today that Electronic Design News (EDN), published by Reed Business Information, has named Interlink Electronics' MicroNav Ring technology to its annual Hot 100 Products of the year. Interlink's MicroNav Ring is a proprietary interface product that provides intuitive menu scrolling to enhance the usability of handheld electronic devices. In naming MicroNav Ring to their Hot 100 Products list, EDN's technical editors analyzed and compared candidates from all of the products appearing in the pages of EDN during 2005. "Over the course of a year, EDN covers an incredible number of products spread across the breadth of the electronics industry," states Editor in Chief, Maury Wright. "We choose the 100 that we think will prove most significant and useful to the design engineer. Communications and multimedia were two of the leading application areas in our selections this year, as consumer electronics and audio-visual products continue to be the strongest market drivers in technology." "The MicroNav Ring circular scrolling interface solution offers unique advantages to consumers and to the designers of handheld electronics products," adds Rod Vesling, Vice President of Sales and Marketing, Interlink Electronics, Inc. "To the consumer, MicroNav Ring provides an intuitive circular menu scrolling wheel that enables quick access to device content and functions. To the design engineer, it provides a robust user interface rugged enough for typical use in outdoor environments. MicroNav Ring is also cost-effective and versatile, supporting direct integration with the device host processor and allowing the use of metallic actuators, EL and LED lighting, and more. MicroNav Ring is a very low power consumption technology." MicroNav Ring is a member of Interlink Electronics' MicroNav family of proprietary interface products. Utilizing the company's patented Force Sensing Resister(R) (FSR) technology, MicroNav interface solutions enable circular menu scrolling, 360 degree "mouse" navigation and pressure switch sensing for handheld consumer electronics including mobile phones, MP3 players, remote controls and more. More information on Interlink's MicroNav family of products, which includes the MicroNav Ring, MicroNav 360 degree, MicroNav Array, MicroNav Strip and MicroNav Touchpad, is available at http://www.micronavlink.com. About EDN EDN is published by Reed Business Information (www.reedbusiness/us.com), the largest business-to-business publisher in the U.S. and a member of the Reed Elsevier Group plc (NYSE: RUK and ENL) - a world-leading publisher and information provider operating in the science and medical, legal, education and business-to-business industry sectors. Known as the "Voice of the engineer," Waltham, MA-based EDN serves the vital information needs of design engineers and engineering managers worldwide. The EDN franchise includes EDN, EDN Europe, EDN Asia, EDN Australia, EDN China, EDN Japan, and EDN.com. For more information on EDN's Hot 100 Products award, see EDN's December 16, 2005 issue and at http://www.edn.com/051216cs About Interlink Electronics, Inc. Interlink Electronics, Inc. (NASDAQ:LINKE) is a world leader in the development of intuitive interface technologies and solutions for business and home applications. Creating today's interface standards, our business communications, e-transactions, home entertainment and specialty components businesses have established Interlink as the comprehensive source for branded and OEM solutions. Selected customers include Dell, HP/Compaq, InFocus, Microsoft, Mitsubishi, NEC, Sanyo, Sharp, Sony and Toshiba. Recognized worldwide for innovative interface technologies and solutions, Interlink Electronics, Inc. serves an international customer base from its corporate headquarters in Camarillo, California and offices in Tokyo, Hong Kong and China. The Company currently holds numerous patents on sensor technologies, e-signature technologies, wireless communication protocols and product design properties. See Interlink Electronics online at http://www.interlinkelectronics.com/ or in Japan at http://www.interlinkelec.co.jp/ All registrations and trademarks are properties of their respective owners. This document contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: business conditions and growth in the electronics industry and general economies, both domestic and international; lower than expected customer orders; delays in receipt of orders or cancellation of orders; competitive factors, including increased competition, new product offerings by competitors and price pressures; the availability of third party parts and supplies at reasonable prices; changes in product mix; significant quarterly performance fluctuations due to the receipt of a significant portion of customer orders and product shipments in the last month of each quarter; and product shipment interruptions due to manufacturing problems. The forward-looking statements contained in this document regarding industry and revenue trends, industry product and technology acceptance, product mix and future business activities should be considered in light of these factors.