Agreement builds on existing collaboration
between the two companies for the joint development of 2nm node
technology
TOKYO, June 3, 2024
/PRNewswire/ -- Rapidus Corporation, a manufacturer of advanced
logic semiconductors, and multinational technology company IBM
(NYSE: IBM), today announced a joint development partnership aimed
at establishing mass production technologies for chiplet packages.
Through this agreement, Rapidus will receive packaging technology
from IBM for high-performance semiconductors, and the two companies
will collaborate with a goal of further innovating in this
space.
![From left to right: Atsuyoshi Koike, President and CEO, Rapidus, and Norishige Morimoto, Vice President of IBM Japan, Chief Technology Officer, IBM Research & Development From left to right: Atsuyoshi Koike, President and CEO, Rapidus, and Norishige Morimoto, Vice President of IBM Japan, Chief Technology Officer, IBM Research & Development](https://mma.prnewswire.com/media/2428710/Rapidus_IBM.jpg)
This agreement is part of an international collaboration within
the framework of the "Development of Chiplet and Package Design and
Manufacturing Technology for 2nm-Generation Semiconductors" project
being conducted by Japan's New
Energy and Industrial Technology Development Organization (NEDO)
and builds on an existing agreement with IBM for the joint
development of 2nm node technology. As part of the agreement, IBM
and Rapidus engineers will work in collaboration at IBM's
facilities in North America for
R&D and manufacturing of semiconductor packaging for
high-performance computer systems.
Over the years, IBM has accumulated R&D and manufacturing
technologies for semiconductor packaging for high-performance
computer systems. The company also has a wealth of experience with
joint development partnerships with Japanese semiconductor
manufacturers, as well as manufacturers of semiconductors, package
manufacturing equipment, and materials. Rapidus aims to leverage
this expertise to quickly establish cutting-edge chiplet packaging
technology.
Rapidus President and CEO Dr. Atsuyoshi
Koike commented: "Building on our current joint development
agreement for 2nm semiconductor technology, we are extremely
pleased to officially announce today this partnership with IBM to
establish chiplet packaging technology. We will make the most of
this international collaboration and pursue initiatives that will
allow Japan to play an even more
important role in the semiconductor packaging supply chain."
Darío Gil, SVP and Director of Research at IBM, said: "With
decades of innovation in advanced packaging, IBM is honored to
expand our collaboration with Rapidus to develop state-of-the-art
chiplet technology. Through our agreement, we are committed to
supporting the development of the most advanced node production
processes, design, and packaging, as well as developing new use
cases and supporting the semiconductor workforce."
About IBM
IBM is a leading provider of global hybrid
cloud and AI, and consulting expertise. We help clients in more
than 175 countries capitalize on insights from their data,
streamline business processes, reduce costs and gain the
competitive edge in their industries. More than 4,000 government
and corporate entities in critical infrastructure areas such as
financial services, telecommunications and healthcare rely on IBM's
hybrid cloud platform and Red Hat OpenShift to affect their digital
transformations quickly, efficiently and securely. IBM's
breakthrough innovations in AI, quantum computing,
industry-specific cloud solutions and consulting deliver open and
flexible options to our clients. All of this is backed by IBM's
legendary commitment to trust, transparency, responsibility,
inclusivity and service. Visit ibm.com for more information.
About Rapidus
Rapidus Corporation aims to develop and
manufacture the world's most advanced logic semiconductors. By
developing and providing services to shorten cycle times for
design, wafer processes, 3D packaging, and other aspects of
semiconductor production, Rapidus creates new industries together
with customers. We continue to embrace challenges that contribute
to the fulfillment, prosperity, and happiness of people's lives
using semiconductors.
Media contacts:
Kreab K.K. (Japan)
Kunihiko Yasue, Kreab
E-mail: kyasue@kreab.com
Takano Okumoto, Kreab
E-mail: tokumoto@kreab.com
Miki Yagi, Kreab
E-mail: myagi@kreab.com
Breakaway Communications (U.S.)
Devan Gillick,
rapidus@breakawaycom.com
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SOURCE Rapidus Corporation