Soitec Announces the Addition of Piezoelectric-On-Insulator (poi) Substrate Capacity to Meet Increasing Demand for 4g/5g rf F...
13 September 2019 - 8:00AM
Soitec Announces the Addition of Piezoelectric-On-Insulator (poi)
Substrate Capacity to Meet Increasing Demand for 4g/5g rf Filters
SOITEC ANNOUNCES THE ADDITION OF
PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE CAPACITY TO MEET
INCREASING DEMAND FOR 4G/5G RF FILTERS
POI brings combined performance and
integration to smartphones’ 4G and 5G filters for mass
markets
Bernin, France, September 13th,
2019 — Soitec (Euronext Paris), an industry leader
in designing and manufacturing innovative semiconductor materials
announced today that it is increasing production capacity of its
piezoelectric-on-insulator (POI) substrate to meet growing customer
demand.
POI is an innovative substrate manufactured
thanks to Soitec’s proprietary Smart CutTM technology. At its
foundation lies a high resistivity silicon substrate, complemented
by a buried oxide layer and a very thin and uniform layer of a
mono-crystal piezo material on top.
4G and 5G networks are using an increasing
number of frequency bands to enable high speed data transmission.
As a result, smartphones must integrate a higher number of filters
with enhanced performance to ensure signal integrity and reliable
communication.
“Our POI engineered substrates, designed to
build the latest generation of 4G/5G Surface Acoustic Wave (SAW)
filters, offer built-in temperature compensation and allow the
integration of multiple filters on a single die” said Dr. Bernard
Aspar, Senior Executive Vice President of Soitec’s Global Business
Units. “The unique value brought by our POI engineered substrates
is recognized by our customers and today we are increasing
production capacity in our Bernin 3 wafer fabrication plant to meet
this demand”.
About Soitec
Soitec (Euronext Paris) is an industry leader in
designing and manufacturing innovative semiconductor materials. The
company uses its unique technologies and semiconductor expertise to
serve the electronics markets. With more than 3,500 patents
worldwide, Soitec’s strategy is based on disruptive innovation to
answer its customers’ needs for high performance, energy efficiency
and cost competitiveness. Soitec has manufacturing facilities,
R&D centers and offices in Europe, the U.S. and Asia.
Soitec and Smart Cut are registered trademarks
of Soitec.
For more information, please visit
www.soitec.com and follow us on Twitter: @Soitec_EN.
Investor RelationsSteve Babureck +33 6 16 38
56 27 +1 858 519 6230steve.babureck@soitec.com
|
Media
Contact Alexandra Givert+33 6 72 89 00
53alexandra.givert@soitec.com Isabelle Laurent+33 1 53 32 61
51 isabelle.laurent@oprgfinancial.fr Fabrice Baron+33 1 53
32 61 27fabrice.baron@oprgfinancial.fr |
# # #
Soitec is a French joint-stock corporation with
a Board of Directors (Société Anonyme à Conseil d’administration)
with a share capital of €65,234,492.80, having its registered
office located at Parc Technologique des Fontaines - Chemin des
Franques - 38190 Bernin (France), and registered with the Grenoble
Trade and Companies Register under number 384 711 909.
# # #
- PR POI September 2019_EN
- 2018_05_31_© Tomoya Fujimoto
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