NeuPro-M delivers an industry leading 350
TOPS/Watt to bring the power of Generative AI to infrastructure,
industrial, automotive, PC, consumer, and mobile markets with
exceptional cost and power efficiency
ROCKVILLE, Md., Aug. 7, 2023
/PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of
wireless connectivity, smart sensing technologies and custom SoC
solutions, today announced its enhanced NeuPro-M NPU family,
directly addressing the processing needs of the next era of
Generative AI with industry-leading performance and power
efficiency for any AI inferencing workload, from cloud to the edge.
The NeuPro-M NPU architecture and tools have been extensively
redesigned to support transformer networks in addition to CNNs and
other neural networks, as well as support for future machine
learning inferencing models. This enables highly-optimized
applications leveraging the capabilities of Generative and classic
AI to be seamlessly developed and run on the NeuPro-M NPU inside
communication gateways, optically connected networks, cars,
notebooks and tablets, AR/VR headsets, smartphones, and any other
cloud or edge use case.
Ran Snir, Vice President and General Manager of the Vision
Business Unit at CEVA, commented: "Transformer-based networks that
drive Generative AI require a massive increase in compute and
memory resources, which calls for new approaches and optimized
processing architectures to meet this compute and memory demand
boost. Our NeuPro-M NPU IP is
designed specifically to handle both classic AI and Generative AI
workloads efficiently and cost-effectively today and in the future.
It is scalable to address use cases from the edge to the cloud and
is future proof to support new inferencing models. The leap in
performance we have achieved with this architecture brings the
incredible promise of Generative AI to any use case, from
cost-sensitive edge devices all the way up to highly-efficient
cloud computing and everything in between."
ABI Research forecasts that Edge AI shipments will grow from 2.4
billion units 2023 to 6.5 billion units in 2028, at a common annual
growth rate (CAGR) of 22.4%*. Generative AI is set to play a vital
role in underpinning this growth, and increasingly sophisticated
and intelligent edge applications are driving the need for more
powerful and efficient AI inferencing techniques. In particular,
the Large Language Models (LLMs) and vision and audio transformers
used in generative AI can transform products and industries but
introduce new levels of challenges in terms of performance, power,
cost, latency and memory when running on edge devices.
Reece Hayden, Senior Analyst, ABI
Research, stated: "The hardware market for Generative AI today is
heavily concentrated with dominance by a few vendors. In order to
deliver on the promise of this technology, there needs to be a
clear path to lower power, lower cost inference processing, both in
the cloud and at the edge. This will be achieved with smaller model
sizes and more efficient hardware to run it. CEVA's NeuPro-M NPU IP
offers a compelling proposition for deploying generative AI
on-device with an impressive power budget, while its scalability
also allows NeuPro-M to address more performance-intense use cases
in network equipment and beyond."
By evolving inferencing and modeling techniques, new
capabilities for leveraging smaller, domain-specific LLMs, vision
transformers and other generative AI models at the device-level are
set to transform applications in infrastructure, industrial,
mobile, consumer, automotive, PC, consumer, and mobile markets.
Crucially, the enhanced NeuPro-M architecture is highly versatile
and future proof thanks to an integrated VPU (Vector Processing
Unit), supporting any future network layer. Additionally, the
architecture supports any activation and any data flow, with true
sparsity for data and weights that enables up to 4X acceleration in
performance, allowing customers to address multiple applications
and multiple markets with a single NPU family. To enable larger
scalability that is required by diverse AI markets, the NeuPro-M
adds new NPM12 and NPM14 NPU cores, with two and four NeuPro-M
engines, respectively, to easily migrate to higher performance AI
workloads, with the enhanced NeuPro-M family now comprising four
NPUs – the NPM11, NPM12, NPM14, and NPM18. This versatility along
with exceptional performance and power efficiency make NeuPro-M the
leading NPU IP available in the
industry today, with peak performance of 350 TOPS/Watt at a 3nm
process node and capable of processing more than 1.5 million tokens
per second per watt for a transformer-based LLM inferencing.
Accompanying the enhanced NeuPro-M architecture is a revamped
comprehensive development tool chain, based on CEVA's award-winning
neural network AI compiler, CDNN, which is architecture aware for
full utilization of the NeuPro-M parallel processing engines and
for maximizing customer's AI application performance. The CDNN
software includes a memory manager for memory bandwidth reduction
and optimal load balancing algorithms, and is compatible with
common open-source frameworks, including TVM and ONNX.
Availability
The NPM11 NPU
IP is generally available for customer deployment today,
with the NPM12, NPM14, and NPM18 available for lead customers. For
more information, visit
https://www.ceva-dsp.com/product/ceva-neupro-m/.
*Source: ABI Research, AN-5774, QTR 1 2023
About CEVA, Inc.
CEVA is the leading licensor of
wireless connectivity and smart sensing technologies and custom SoC
solutions for a smarter, safer, connected world. We provide Digital
Signal Processors, AI engines, wireless platforms, cryptography
cores and complementary embedded software for sensor fusion, image
enhancement, computer vision, spatial audio, voice input and
artificial intelligence. These technologies are offered in
combination with our Intrinsix IP integration services, helping our
customers address their most complex and time-critical integrated
circuit design projects. Leveraging our technologies and chip
design skills, many of the world's leading semiconductors, system
companies and OEMs create power-efficient, intelligent, secure and
connected devices for a range of end markets, including mobile,
consumer, automotive, robotics, industrial, aerospace & defense
and IoT.
Our DSP-based solutions include platforms for 5G baseband
processing in mobile, IoT and infrastructure, advanced imaging and
computer vision for any camera-enabled device, audio/voice/speech
and ultra-low-power always-on/sensing applications for multiple IoT
markets. For motion sensing solutions, our Hillcrest Labs sensor processing technologies
provide a broad range of sensor fusion software and inertial
measurement unit ("IMU") solutions for markets including hearables,
wearables, AR/VR, PC, robotics, remote controls and IoT. For
wireless IoT, our platforms for Bluetooth connectivity (low energy
and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB),
NB-IoT and GNSS are the most broadly licensed connectivity
platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube,
Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.