Soitec kicks off European project to develop future high-frequency semiconductors
10 September 2024 - 8:00AM
UK Regulatory
Soitec kicks off European project to develop future high-frequency
semiconductors
Soitec kicks off European project
to develop future high-frequency
semiconductors
Bernin, France, 10th September
2024 – A European research and industry consortium led by
Soitec, a world leader in the design and manufacture of innovative
semiconductor materials, has begun work to develop a future
generation of high-frequency semiconductors based on Indium
Phosphide (InP).
These technologies are set to address
applications ranging from photonics for mega data centers and AI to
radio frequency front-ends and integrated antennas critical for 6G
mobile communication, Sub-THz radar sensing and beyond.
Indium phosphide (Inp) devices can operate at
frequencies approaching or exceeding 1 terahertz (THz), offering
superior speeds and increased energy-efficiency compared to silicon
technologies.
The 27-member consortium, Move2THz, aims to lay
the groundwork for a robust European supply and manufacturing
ecosystem for InP semiconductors and tackle barriers to their wider
adoption, including the cost and availability of InP-based advanced
substrates. The three-year project is a recipient of European Union
funding as well as top-up financing from the governments of France,
Switzerland, Germany, Sweden, the Netherlands and Belgium.
Emmanuelle Bely, Soitec General Secretary,
stated:
“This project marks a key milestone in the
integration of ever more powerful and energy-efficient
semiconductor technologies. Together, we are paving the way for
innovation based on indium phosphide that will transform critical
sectors such as 6G telecommunications, photonics and artificial
intelligence. Furthermore, it fully embodies our shared ambition to
create a strong and autonomous European ecosystem capable of
meeting the technical and economic challenges to large-scale
adoption of these cutting-edge technologies."
Work formally began at a July 9-10 kick-off
meeting at Soitec headquarters in Bernin, France.
The consortium members are:
France |
Soitec (project lead)
French Alternative Energies and Atomic Energy Commission
STMicroelectronics
National Center for Scientific Research
Institute of Electronics, Microelectronics and Nanotechnology
InPACT
III-V Lab
Almae Technologies
The University of Bordeaux |
Germany |
Fraunhofer-Gesellschaft (EMFT and IZM)
Ferdinand-Braun-Institut, Leibniz-Institut für
Höchstfrequenztechnik
Aixtron
University of Duisburg-Essen
Freiberger Compound Materials
Microwave Photonics
Advanced Modeling Solutions (AdMOS) |
Belgium |
Imec
Université catholique de Louvain
Incize |
Switzerland |
Diramics
ETH Zürich
Albis Optoelectronics |
Sweden |
Chalmers University of Technology
Low Noise Factory |
The Netherlands |
Eindhoven University of Technology
Smart Photonics |
Lithuania |
Teraglobus |
About Move2THz
Move2THz is supported by the Chips Joint
Undertaking and its members, including the top-up funding by
National Authorities of France, Switzerland, Germany, Sweden, the
Netherlands, and Belgium, under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions
expressed are however those of the author(s) only and do not
necessarily reflect those of the European Union or the granting
authority. Neither the European Union nor the granting authority
can be held responsible for them.
For more information : https://www.move2thz.eu/
About Soitec
Soitec (Euronext - Tech Leaders), a world leader
in innovative semiconductor materials, has been developing
cutting-edge products delivering both technological performance and
energy efficiency for over 30 years. From its global headquarters
in France, Soitec is expanding internationally with its unique
solutions, and generated sales of 1 billion Euros in fiscal year
2023-2024. Soitec occupies a key position in the semiconductor
value chain, serving three main strategic markets: Mobile
Communications, Automotive and Industrial, and Edge and Cloud AI.
The company relies on the talent and diversity of its 2,300
employees, representing 50 different nationalities, working at its
sites in Europe, the United States and Asia. Soitec has registered
over 4,000 patents.
Soitec, SmartSiC™ and Smart Cut™ are registered
trademarks of Soitec.
For more information: https://www.soitec.com/en/
and follow us on X: @Soitec_Official
Contact for more information:
media@soitec.com
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