BERNIN, France, September 9, 2013 /PRNewswire/ --
Soitec (Euronext), a world leader in generating and
manufacturing revolutionary semiconductor materials for the
electronics and energy industries, has licensed some of its
intellectual property (IP) portfolio related to back-side
illumination (BSI) technology for image sensors to Taiwan
Semiconductor Manufacturing Company, Limited (TSMC), a leading
foundry provider of image sensor products. BSI is a key enabling
technology in the race to develop small-pixel, high-quality image
sensors used in consumer products such as digital cameras, smart
phones and other portable electronics.
"We are very
pleased to strengthen our relationship with
TSMC. This licensing agreement
demonstrates the value of
Soitec's extensive and generic patent
portfolio in manufacturing advanced devices such as BSI
image sensors," said Paul Boudre, chief operating officer
at Soitec. "We look
forward to continuing to leverage
our IP portfolio by providing our partners with
access to our technologies."
Soitec uses its strong portfolio of technologies
and its high capacity for innovation to deliver enhanced
performance and energy efficiency to the electronics and energy
markets. Today Soitec's IP portfolio contains nearly
3,000 patents covering several technologies for manufacturing
engineered wafers and to be used as building blocks in leading-edge
microelectronic products such as BSI image sensors. In
this case, the back side illumination technology for image sensors
uses some of the key process steps of Soitec's Smart Stacking™
generic technology.
About Soitec: Soitec is an international manufacturing
company, a world leader in generating and manufacturing
revolutionary semiconductor materials at the frontier of the most
exciting energy and electronic challenges. Soitec's products
include substrates for microelectronics (most notably SOI:
Silicon-on-Insulator) and concentrator photovoltaic systems (CPV).
The company's core technologies are Smart Cut™, Smart Stacking™ and
Concentrix™, as well as expertise in epitaxy. Applications include
consumer and mobile electronics, microelectronics-driven IT,
telecommunications, automotive electronics, lighting products and
large-scale solar power plants. Soitec has manufacturing plants and
R&D centers in France,
Singapore, Germany and the
United States. For more information, visit:
http://www.soitec.com.
International Media Contacts
Camille Darnaud-Dufour (trade
press)
+33(0)6-79-49-51-43
camille.darnaud-dufour@soitec. com
Marylen Schmidt (business
press)
+33(0)4-76-92-87-83
marylen.schmidt@soitec.com
Investor Relations
Olivier Brice
+33(0)4-76-92-93-80
olivier.brice@soitec.com
SOURCE Soitec