Molex Announces iPass+™ HSC CXP Copper and Optical System for Fast and Flexible System Hardware
18 November 2009 - 1:00PM
Business Wire
Molex Incorporated (NASDAQ: MOLX) (NASDAQ: MOLXA) announces the
iPass+™ High-Speed Channel (HSC) pluggable CXP copper and
optical interconnect system enabling twelve channels of 10 Gbps
data, for up to 120 Gbps of total bandwidth. The iPass+™ CXP
provides both copper and optical direct attach options for the same
system port, thereby increasing the flexibility of system-level
hardware for end users. This innovative dual paddle-card system was
adopted as the InfiniBand* Architecture Specification Vol. 2
Release 1.2.1; Annex A6 in September 2009.
“Molex’s first-to-market iPass+ HSC CXP system results in one of
the fastest and highest-density I/Os on the market today,” said Jay
Neer, advanced technical market manager, industry standards, Molex
Incorporated. “By leveraging Molex high-speed wafer technology with
compliant pin tails, we were able to develop a higher density,
12-channel I/O connector system which meets the needs of the
growing high performance and computer data center market.”
The unitary press-fit connector and cage assembly provides
one-step placement to the host board and is offered in both single
and stacked dual-port configurations. Molex CXP 12X direct attach
copper cables are designed to accommodate single, ganged or stacked
connector configurations in extremely high-density requirements.
CXP passive copper cables are available in a variety of
lengths.
Further, Molex is developing optical CXP solutions with AOC
(active optical cables) pluggable optical module cable assemblies
and loopbacks. Cabling options for CXP optical products include
24-fiber round OFNP rated jackets in 3.8 and 5.4mm diameters
filling both shorter rack-to-rack and longer riser cabling
requirements. The round cable construction offers superior fiber
management over traditional flat cables for connecting CXP ports.
CXP optical cable assemblies for pluggable transceiver applications
utilize 24 fiber (12 transmit and 12 receive) high bandwidth OM3
cable using industry-standard MTP/MPO connectors. This design meets
the InfiniBand bandwidth requirements for CXP modules for lengths
up to 300m (984.25’). Products also include MTP/MPO-to-LC cable
assemblies for connections to Small Form-factor Pluggable (SFP) or
LC patch panels. MPO CXP Loopbacks feature a compact housing that
loops optical TX to RX ports for testing, burn-in and field
troubleshooting.
Molex’s iPass+ HSC CXP system is the latest addition to the
existing iPass™ product family. The iPass Interconnect System
offers connectors and cables that enable flexible-speed
compatibility for applications ranging from 1 to 10 Gbps and is an
ideal solution for the growing high-performance computing and data
center markets. To learn more, stop by the Molex booth 712 at the
Super Computing conference (SC09), November 14-20 in Portland, Ore.
or visit http://www.molex.com/link/cxp.html.
About Molex Incorporated
Molex Incorporated is a 71-year-old global manufacturer of
electronic, electrical and fiber optic interconnection systems.
Based in Lisle, Illinois, USA, the company operates 43
manufacturing locations in 18 countries. The Molex website is
www.molex.com.
Molex is a registered trademark of Molex Incorporated
*InfiniBand is a registered trademark of the InfiniBand Trade
Association
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