0RFB Senvion Sa

Dow Jones received a payment from EQS/DGAP to publish this press release.

 
 
 Senvion S.A. (IRSH) 
Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders 
and main bond holders 
 
17-Apr-2019 / 18:46 CET/CEST 
Dissemination of a Regulatory Announcement that contains inside information 
according to REGULATION (EU) No 596/2014 (MAR), transmitted by EQS Group. 
The issuer is solely responsible for the content of this announcement. 
 
*Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders 
and main bond holders* 
 
*Luxembourg, 17April 2019**:* Senvion GmbH - the main operative business 
entity of the Senvion Group - and its lenders and main bond holders have 
signed a binding loan agreement, setting forth terms for a EUR 100m 
so-called 'Massekredit'. The debtor-in-possession (DIP) facility enables 
Senvion Group to continue its business operations following last week's 
self-administration filing for certain entities of Senvion Group. The loan 
facility has received all Board approvals and allows substantial drawings 
already this week, thus enabling the company to stabilize its business 
operations and provide funds to its non-insolvent subsidiaries. 
 
The Management Board 
 
Senvion Investor Relations contact (Notifying Person): 
Anja Siehler 
Senior Manager - Capital Markets 
phone: +352 26 00 - 5285 
email: anja.siehler@senvion.com 
 
Contact: 
Anja Siehler 
Tel: +352 26 00 5285 
Mobil: +4915221817093 
E-mail: anja.siehler@senvion.com 
 
ISIN:           LU1377527517, XS1223808749, XS1223809390 
Category Code:  MSCU 
TIDM:           IRSH 
LEI Code:       549300WUKZSK5CX6SM09 
OAM Categories: 2.2. Inside information 
Sequence No.:   8247 
EQS News ID:    801439 
 
End of Announcement EQS News Service 
 
 

(END) Dow Jones Newswires

April 17, 2019 12:47 ET (16:47 GMT)

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