Intel Breakthroughs Propel Moore’s Law Beyond 2025
11 Dezember 2021 - 10:30PM
Business Wire
Intel targets more than 10x density
improvement in packaging and 30% to 50% logic scaling improvements,
and looks beyond classic silicon transistors.
What’s New: In its relentless pursuit of Moore’s Law,
Intel is unveiling key packaging, transistor and quantum physics
breakthroughs fundamental to advancing and accelerating computing
well into the next decade. At IEEE International Electron Devices
Meeting (IEDM) 2021, Intel outlined its path toward more than 10x
interconnect density improvement in packaging with hybrid bonding,
30% to 50% area improvement in transistor scaling, major
breakthroughs in new power and memory technologies, and new
concepts in physics that may one day revolutionize computing.
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“At Intel, the research and
innovation necessary for advancing Moore’s Law never stops. Our
Components Research Group is sharing key research breakthroughs at
IEDM 2021 in bringing revolutionary process and packaging
technologies to meet the insatiable demand for powerful computing
that our industry and society depend on. This is the result of our
best scientists’ and engineers’ tireless work. They continue to be
at the forefront of innovations for continuing Moore’s Law.”
–Robert Chau, Intel Senior Fellow and general manager of Components
Research
Why It Matters: Moore’s Law has been tracking innovations
in computing that meet the demands of every technology generation
from mainframes to mobile phones. This evolution is continuing
today as we move into a new era of computing with unlimited data
and artificial intelligence.
Continuous innovation is the cornerstone of Moore’s Law. Intel’s
Components Research Group is committed to innovating across three
key areas: essential scaling technologies for delivering more
transistors; new silicon capabilities for power and memory gains;
and exploration of new concepts in physics to revolutionize the way
the world does computing. Many of the innovations that broke
through previous barriers of Moore’s Law and are in today’s
products started with the work of Component Research – including
strained silicon, Hi-K metal gates, FinFET transistors, RibbonFET,
and packaging innovations including EMIB and Foveros Direct.
How We Are Doing It: The breakthroughs revealed at IEDM
2021 demonstrate Intel is on track to continue the advancement and
benefits of Moore’s Law well beyond 2025 through its three areas of
pathfinding.
1. Intel is pursuing significant research in essential
scaling technologies for delivering more transistors in future
product offerings:
- Researchers at the company have outlined solutions for the
design, process, and assembly challenges of hybrid bonding
interconnect, envisioning a more than 10x interconnect density
improvement in packaging. At the Intel Accelerated event in July,
Intel announced plans to introduce Foveros Direct, enabling
sub-10-micron bump pitches, providing an order of magnitude
increase in the interconnect density for 3D stacking. To enable the
ecosystem to gain benefits of advanced packaging, Intel is also
calling for the establishment of new industry standards and testing
procedures to enable a hybrid bonding chiplet ecosystem.
- Looking beyond its gate-all-around RibbonFET, Intel is
mastering the coming post-FinFET era with an approach to stacking
multiple (CMOS) transistors that aims to achieve a maximized 30% to
50% logic scaling improvement for the continued advancement of
Moore’s Law by fitting more transistors per square millimeter.
- Intel is also paving the way for Moore’s Law advancement into
the angstrom era with forward-looking research showing how novel
materials just a few atoms thick can be used to make transistors
that overcome the limitations of conventional silicon channels,
enabling millions more transistors per die area for evermore
powerful computing in the next decade.
2. Intel is bringing new capabilities to silicon:
- More efficient power technologies are advancing through the
world’s first integration of GaN-based power switches with
silicon-based CMOS on a 300 mm wafer. This sets the stage for
low-loss, high-speed power delivery to CPUs while simultaneously
reducing motherboard components and space.
- Another advancement is Intel’s industry-leading, low-latency
read/write capabilities using novel ferroelectric materials for
possible next-generation embedded DRAM technology that can deliver
greater memory resources to address the growing complexity of
compute applications, from gaming to AI.
3. Intel is pursuing massive performance with silicon
transistor-based quantum computing, as well as entirely new
switches for massively energy-efficient computing with novel room
temperature devices. In the future, these revelations may replace
classic MOSFET transistors by using entirely new concepts in
physics:
- At IEDM 2021, Intel demonstrated the world’s first experimental
realization of a magnetoelectric spin-orbit (MESO) logic device at
room temperature, which showed the potential manufacturability for
a new type of transistor based on switching nanoscale magnets.
- Intel and IMEC are making progress with spintronic materials
research to take device integration research close to realizing a
fully functional spin-torque device.
- Intel also showcased full 300 mm qubit process flows for the
realization of scalable quantum computing that is compatible with
CMOS manufacturing and identifies next steps for future
research.
About Components Research: Components Research, the
research group of Intel Technology Development, is responsible for
delivering revolutionary process and packaging technology options
that extend Moore’s Law and enable Intel products and services. It
keeps Intel’s research and development pipeline full by working
with the company’s business units to anticipate future needs and
collaborating with external groups – from U.S. government research
labs and industry consortia to university research groups and
suppliers.
More Context: 3D Stacked Transistors: Improving Area by
Building Upward (Video) | Foveros Direct: Advanced Packaging
Technology to Continue Moore’s Law (Video) | Intel's Components
Research Group Invents Revolutionary Process and Package Tech
(Video)
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
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Bruce Fienberg 1-510-220-6461 bruce.fienberg@intel.com
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