ASE Receives Cisco 2021 Excellence in Technology Enablement Award
17 September 2021 - 12:00AM
Business Wire
Advanced Semiconductor Engineering, Inc. (ASE), the leading
global provider of semiconductor manufacturing services in assembly
and test, today announced it was the recipient of the Cisco 2021
Excellence in Technology Enablement Award. Cisco unveiled the award
winners at its annual Supplier Appreciation Event (SAE). The 30th
annual SAE was aired virtually for the second year in a row on
Cisco TV on September 14, 2021.
This award recognizes ASE for creating and delivering
exceptional, unique technology and/or value proposition for Cisco,
and consistently introducing emerging or unique technology to
enable Cisco's success.
“The way we anticipate, navigate and respond to global events
that impact our industry will determine how the world builds a more
sustainable, more resilient, and more inclusive future,” said Marco
De Martin, vice president, Global Supplier Management, Cisco. “Our
theme this year, ‘Together Toward Tomorrow’ highlights the
criticality of our extended partner and supplier network. Despite
the tremendous challenges we faced this past year, we have
collectively remained focused on our shared goals. Together with
our valued partners, we look forward to continuing to help our
customers reimagine their applications, power hybrid work,
transform their infrastructure and secure their enterprise.”
At the event, Cisco celebrated the collective achievements and
contributions of its most strategic supply chain partners and
recognized the suppliers and partners that executed exceptionally
well across the supply chain.
About ASE, Inc.
ASE, Inc. is the leading global provider of semiconductor
manufacturing services in assembly and test. Alongside a broad
portfolio of established assembly and test technologies, ASE
delivers innovative advanced packaging and system-in-package
solutions to meet growth momentum across a broad range of end
markets, including 5G, Artificial Intelligence, Automotive,
High-Performance Computing, and more. To learn about our advances
in System-in-Package, Fanout, MEMS & Sensor, Flip Chip, and
2.5D, 3D and TSV technologies, all ultimately geared towards
applications to improve lifestyle and efficiency, please visit:
aseglobal.com.
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of Cisco and/or its affiliates in the U.S. and other countries.
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